The new facility is one of Japan’s largest investments overseas in the past decade for a key component in the semiconductor supply chain.
AST will operate Singapore’s first Flip Chip Ball Grid Array (FC-BGA) substrates manufacturing facility, adding to the vibrancy of Singapore’s semiconductor sector. With target to start production by end-2026, AST will serve growing demand for FC-BGA substrates globally, amid growing adoption of genAI and machine learning.